The SignalPath™ 230 (SP230) is an advanced
signaling protocol converter designed
to facilitate interoperability between
incompatible world-wide networks. The
SP230 enables a seamless interface between
in-band and out-of-band networks, and
between out-of-band networks and other
out-of-band networks.
Different types of telephony communication
protocols, both in-band and out-of-band,
circuit-switched and packet, exist globally.
In fact, there could be as many as six
or seven protocols variants simultaneously
in use within one network.The SP230 breaks
down the communication barriers presented
by these different protocols and enables
the flow of information between networks.
A typical scenario is a next-generation,
SS7- based packet network connecting
to an older network based on in-band
CAS signaling.
In addition, our proprietary address
translation technology enables the SP230
to be positioned virtually anywhere within
a network for routing ISUP messages between
switches located in different SS7 networks.
This technology allows the SP230 to support
both symmetric and asymmetric network
configurations, allowing for greater
flexibility in building revenue-producing
networks.
With the SP230, not only can you increase
your potential to connect to a larger
portion of the world market, but you
can also eliminate charges you may be
currently paying to one or more companies
for network connections. That means you
can offer bigger savings to more customers,
which translates to more revenue in your
corporate pocket.
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EXTENSIVE
PROTOCOL SUPPORT
Multiple protocol support in a single platform
means better inventory management and lower
overall operating costs. Protocols supported
are:
• R1, R2, DTMF
• ANSI SS7 (ANSI), ITU-T C7, ETSI ISUP, Spanish ISUP, NOM112, C7 variants
(e.g., Argentina, Chile, Peru, Spain)
• NI2 and ETSI PRI-ISDN
• Custom variants of both in-band and out-of-band protocols are available
SUPERIOR
MAINTENANCE AND DIAGNOSTICS
• Multiple maintenance features enable quick and cost-effective resolution
of network problems.
• Trace functionality is available to aid in troubleshooting configuration
and network problems.
• Visual and dry contact alarms allow for remote and local monitoring.
• The “hot plug-in” feature enables insertion and removal of modules
without affecting operation.
REDUNDANCY
• Redundant common module capability translates to less equipment down-time.
• Redundant power supplies are input and output isolated.
SCALEABLE
ARCHITECTURE
• The SP230 has a modular design, with a capacity of up to 52 E1 or T1
interfaces, allowing users to scale the product to fit small or large applications
while incurring a low upfront investment.
• Address translation that enables support for both symmetric and asymmetric
network configurations.
OTHER FEATURES
• Standard connections (RJ48, BNC)
• Up to 52 E1 or T1 trunks (full duplex, 104 ports)
• Up to 1,612 DS0s per chassis
• Dynamic bi-directional μ-Law/A-Law T1/E1 conversion
• 19 in. (48.26 cm) rack-mountable chassis |
TECHNICAL
SPECIFICATIONS
STANDARDS
CONFORMANCE
R1: Q.310–Q.331
R2: Q.400–Q.490
DTMF: BellCore
TR-TSV-002275, Subsection 6.13
SS7: BellCore
TR-NWT-00246, ANSI T1.111a, T1.112,
T1.113a, T1.114, T1.116, T1.234–T1.236
C7: ITU-T
White Book: Q.767, Q.701– Q.704, Q.705, Q.708, Q.709,
Q.780– Q.782, Q.784, Q.788
ETSI ISDN: ETSI
300-102, Q.931, Q.921
NI2 ISDN: BellCore
TR-NWT-001268, TR-NWT-002343; Q.931, Q.921
AGENCY COMPLIANCE
Safety: EN
60950, European Safety (CE Mark)
UL 1950 3rd Edition, U.S. Safety
C22.2 No. 950, Canadian Safety
EMC: EN
300 386-2: 1997 EU EMC (CE Mark)
Emissions: FCC
Part 15, Sub-part B, Class A
HARDWARE SPECIFICATIONS
Height: 10.5
in. (26.7 cm)
Width: 19
in. (48.26 cm)
Depth: 14
in. (35.6 cm)
Input
Power: -48 to -56 VDC
Temperature: 32°
to 122° F (0° to 50° C)
Humidity: Up
to 95% non-condensing
Altitude: Up
to 10,000 ft. (3,048 m)
SYSTEM CAPACITY
Aggregate
Cards: Up to 13 per chassis
Interfaces: Up
to 8 E1 or T1 trunks per Aggregate
card; up to 104 full duplex trunks
per chassis
Channels: Up
to 31 per trunk; up to 248 per Aggregate card; up to
3,224 per chassis
SS7/C7: Four
per AGC card
Signaling Links: Eight
per card set; Up to 52 per chassis
DPC: Four
per card set; Up to 56 per chassis
INTERFACE
SPECIFICATIONS
Framing:
E1: G.732 or G.706
T1: D4 SF or D4ESF
Bit Rate:
E1: 2,048 Mbps
T1: 1.544 Mbps
Clocking:
E1: ± 30 ppm internal
E1: ± 100 ppm external
T1: ± 30 ppm internal
T1: ± 150 ppm external
Impedance:
E1: 120 ohm balanced
E1: 75 ohm unbalanced
T1: 100 ohm balanced
Coding:
E1: AMI or HDB3
T1: AMI or B8ZS
Alarms:
E1: Loss of carrier signal, multi-frame carrier signal, sync;
alarm indication signal (AIS); receipt of remote alarm; receipt of multi-frame
remote alarm
T1: Loss of carrier signal; loss of frame; receipt of alarm indication
signal (AIS); receipt of remote alarm
Diagnostics:
E1/T1: signaling state report, digit report
Performance:
E1: G.703, G.706, G.732, G.823
T1: ATT Pub. 62411 |
